Extron BCK SF 3CT LP (part number 70-1256-01) — low-profile plenum-rated back can pair for the SF 3CT LP ceiling speaker, sold without the driver.

At 4.4" H, the BCK SF 3CT LP back can fits plenum spaces too shallow for a standard enclosure while still accepting a separately ordered SF 3CT driver assembly kit to become a complete ceiling speaker. Ordering the can alone suits rough-in work, staged installs, or replacing a damaged enclosure without touching the driver.

Key Capabilities

• Low-profile plenum-rated back can pair for the Extron SF 3CT LP ceiling speaker
• Composite fire-resistant (UL94V-0) enclosure only 4.4" H x 8.9" diameter
• Cutout diameter of 7.6" with V-rail and C-ring mounting for standard ceiling tiles
• UL 2043 listed for plenum airspace use, UL 1480 listed for pro audio systems
• Pairs with a separately ordered SF 3CT driver assembly kit (DAK) to complete the speaker

Where It Is Used

Used on SF 3CT LP installations where plenum height above the ceiling grid is restricted, in conference rooms, classrooms, lecture halls, and auditoriums.

Specifications at a Glance

• Enclosure: Plenum-rated composite back can, UL94V-0, low profile
• Cutout: 7.6" diameter
• Mounting: V-rails for 2' x 4' ceiling tiles, and C-rings
• Pairs with: SF 3CT driver assembly kit (DAK)

Also referenced as ExtronBCKSF3CTLP, Extron-BCK-SF-3CT-LP, part number 70125601.