Extron BCK SF 3C LP (part number 70-1256-11) — low-profile plenum-rated back can pair for the SF 3C LP ceiling speaker, sold without the driver.

At just 4.4" H, the BCK SF 3C LP back can fits plenum spaces too shallow for a standard enclosure while still accepting a separately ordered SF 3C driver assembly kit to become a complete single-driver ceiling speaker. Ordering the can alone suits rough-in work, staged installs, or swapping a damaged enclosure without replacing the driver.

Key Capabilities

• Low-profile plenum-rated back can pair for the Extron SF 3C LP ceiling speaker
• Composite fire-resistant (UL94V-0) enclosure only 4.4" H x 8.9" diameter
• Cutout diameter of 7.6" with V-rail and C-ring mounting for standard ceiling tiles
• UL 2043 listed for plenum airspace use, UL 1480 listed for pro audio systems
• Pairs with a separately ordered SF 3C driver assembly kit (DAK) to complete the speaker

Where It Is Used

Used on SF 3C LP installations where plenum height above the ceiling grid is restricted, in conference rooms, classrooms, and lecture halls.

Specifications at a Glance

• Enclosure: Plenum-rated composite back can, UL94V-0, low profile
• Cutout: 7.6" diameter
• Mounting: V-rails for 2' x 4' ceiling tiles, and C-rings
• Pairs with: SF 3C driver assembly kit (DAK)

Also referenced as ExtronBCKSF3CLP, Extron-BCK-SF-3C-LP, part number 70125611.